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Industrial System on Module CEM710

COM Express Type 7 Basic Module with Intel® Xeon® D-1700 Series Processor

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  • Intel® Xeon® D-1700 series processor (Ice Lake D)
  • 2 DDR4-2400 SO-DIMM for up to 64 GB memory
  • 1 PCIe x16 Gen3 (PEG), 1 PCIe x8 Gen3, and 6 PCIe x1 Gen3
  • 2 SATA Gen3
  • 4 USB 3.0 and 4 USB 2.0
  • 4 10GBase-KR
  • Supports TPM 2.0

Axiomtek's CEM710 is a server-class COM Express® Type 7 basic module powered by the Intel® Xeon® D-1700 processor (Ice Lake D) with up to 10 cores, integrated AI acceleration, and support for hard real-time workloads. Axiomtek's CEM710, engineered to withstand extreme temperatures and harsh industrial conditions, delivers exceptional performance ideally suited for embedded edge AI servers, high-end network testers, network traffic probes, and rugged edge applications. With an industrial temperature range of -40°C to 85°C, Axiomtek's CEM710 ensures reliable performance even in the most demanding environments.

Axiomtek’s CEM710 supports edge computing with IoT-centric features, including built-in AI acceleration, extensive I/O capacity, and hardware-based security. It offers high-bandwidth network and peripheral support, such as a 2.5GbE port, four 10GBASE-KR (10GbE) PHYs, and up to thirty high-speed PCIe 3.0 lanes, delivering true server-class connectivity at the edge. Axiomtek's CEM710 is engineered for reliability in harsh environments, offering standard operating temperatures from 0°C to 60°C (32°F to 140°F) and extended ranges from -40°C to 85°C (-40°F to 185°F) when paired with an appropriate thermal solution. Its rugged design makes it well-suited for high-performance equipment and sealed fanless devices that require continuous operation in the harshest environments, said Kevin Lin, Product Manager of the IDS Division at Axiomtek.

The Intel® Ice Lake D-based Axiomtek's CEM710 has two DDR4-2400 SO-DIMM slots, supporting up to 64GB of ECC memory. It includes one PCIe x16 Gen3 (PEG) slot for high-performance graphics, one PCIe x8 Gen3 slot for flexible expansion, and six PCIe x1 Gen3 slots for additional peripheral connectivity. This industrial-grade system on module offers four USB 3.0 and four USB 2.0 ports, along with interfaces such as LPC, SPI, two TX/RX, two SATA 3.0, and real-time I/O (GPIO and I2C). The module integrates a 2.5GbE port (Intel® Ethernet Controller I226) and four 10GBASE-KR (10GbE) PHYs to enhance backplane network connectivity. Additionally, built-in TPM 2.0 ensures robust hardware-based data protection.